CONTEXT

Most of the currently available methods used for thin film metal deposition lead to high roughness surface usually superior to 10nm and weak adhesion which gets stronger when the deposit get thicker. As a consequence of the widely use of metal layer (micro- and nano-electronic as well as nano- and bio-technology), there is a demand nowadays for methods leading to metal layer having thin thickness, relative low roughness, inferior to 2 nm and improved adhesion.