CONTEXT

Increase of electronic component performances simultaneously to the decrease of their size generates more and more heat problems. Generally the solution is to use a ventilator near the device to cool it globally or to use heat sinks inside.

It appears advantageous to design thermal micro-exchangers in order to evacuate locally the heat released in such devices and systems in creating microchannels of circulation of fluids of heat transfers. Nevertheless, heat flux depends in particular on contact area between the matter and the fluid