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New manufacturing process for microcomponents and MEMS |
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Principal Investigator : Claude LUCAT
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TECHNICAL DESCRIPTION
This invention concerns a manufacturing process of screen printed components or microsystems MEMS (Micro Electro Mechanical Systems) using “sacrificial thick film” method. This temporary “sacrificial layer” makes it possible to release partially or completely thick layers, multi-layer components or discrete ceramics from support on top of it they are deposited.
This “sacrificial layer” used as bearing surface for subsequent deposition, is removed by dissolution and/or heat treatment and/or ultrasonic waves after final sintering of the unit. Components with thickness larger than 1 µm and with surface larger than 100 by 100 µm2 can be carried out. Feasibility of various freestanding metallic or vitreous thick layers with diverse geometries (beam, bridge and tunnel) was shown.
This new process derives from screen printing technique which is a collective manufacturing process considered as a simple and reliable technique. This process is expected to be valuable for the development of hybrid MEMS or microcomponents not readily manufactured with other micromachining technique.
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