CONTEXT

The present invention of M. Doppelt relates to the deposition of thin silver films on various substrates.

Silver is of particular interest as conductive elements for electronic devices because silver is much lower in cost than gold and it possesses much better environmental stability than copper.

Silver is also a metal that cannot be oxidized very well, is chemically fairly stable. This is why, its uses in the form of thin film offers many advantages in the field of high critical temperature Tc superconductors an in microelectronics. In the field of microelectronics, solar cells and flat screens (TFT), the silver can be used in connection in the electronic components by replacing the aluminum or the copper currently used.

Various processes for obtaining a silver deposit on a substrate exist. However, such methods are not sufficient and show low performances and low yield.